Epoxy-based single-component subburial system
u Technical Data Sheet
|
performance |
5521 |
5522 |
5523 |
5524 |
5526 |
|
color |
White/Black |
Transparent |
White/Black |
Black |
White/Black |
|
viscosity （mpa.s，25ºC） |
3000 |
5000 |
10000~20000 |
20000 |
30000~40000 |
|
density （g/cm3） |
1.2 |
1.2 |
1.3 |
1.3 |
1.4 |
|
Curing conditions |
120ºC30min |
100ºC60min |
100ºC90min |
80ºC90min |
120ºC30min |
|
Shear strength（Mpa） |
13 |
13 |
15 |
13 |
15 |
|
Volume resistivity （Ω·cm， 25ºC） |
1.3×1015 |
1.3×1015 |
1.5×1015 |
1.3×1015 |
1.5×1015 |
|
Surface resistivity （Ω， 25ºC） |
1.2×1015 |
1.2×1015 |
1.3×1015 |
1.2×1015 |
1.3×1015 |
|
Dielectric strength （kv/mm） |
20~22 |
20~22 |
20~22 |
20~22 |
20~22 |
|
Tensile strength（kg/mm2） |
11 |
11 |
13 |
11 |
13 |
|
compressive strength （kg/mm2） |
13 |
13 |
15 |
13 |
15 |
|
Shrinkage （%） |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
|
Glass transition temperature （ºC） |
140 |
140 |
150 |
140 |
150 |
Features and uses:
This series of one-component epoxy encapsulant is a heat-curing one-component epoxy encapsulant. Compared with two-component, it has the characteristics of stable storage, high bond strength, good insulation performance, convenient use and strong applicability. It is suitable for potting relays, capacitors, flip-flops, IC circuits, computers, televisions, refrigerators, automobiles, motorcycles and other electronic components.
Typical applications
5521 One-Component Epoxy Encapsulant: The surface gloss can be bright or matte, the color can be white or black, the viscosity is low, it is suitable for potting small slits, and it cures at 30°C for 120 minutes.
5522 One-Component Epoxy Encapsulant: Colorless and transparent, good surface effect, curing at 100°C for 60 minutes.
5523 One-Component Epoxy Encapsulant: The surface gloss can be bright or matte, the color can be white or black, the leveling effect is good, suitable for manual dispensing or machine automatic dispensing, and curing at 90°C for 100 minutes.
5524 One-Component Epoxy Encapsulant: Black Self-Leveling, 80°C 90-minute cure, low temperature cure.
5526 one-component epoxy resin encapsulant: the surface gloss can be bright or foggy, the color can be white or black, the leveling effect is good, suitable for manual dispensing or machine automatic dispensing, 90°C curing for 120 minutes.
Operation process
1. Remove the glue from the refrigerator and leave it at room temperature to equilibrate with the outside world for 1~2 hours.
2. Pour the glue by hand or machine into the part to be encapsulated or into the surface.
3. Slow heating and curing, which is conducive to bubble escape and glue penetration to fill the gaps, and ensure excellent performance.
4. After use, the lid should be closed in time and stored in the refrigerator at 5°C.
Comment
1. This product has an expiration date of 5 months when stored at 3°C, and can still be used after the storage period with suitable viscosity.
2. The curing test should be carried out according to the actual curing conditions and the characteristics of the processing components to ensure the best curing conditions suitable for specific products.
3. This product is non-dangerous goods, and it is stored and transported as non-dangerous goods.
